Publikacje z lat 2021-2026:
- P. Ciszewski, M. Sochacki, W. Stęplewski, et al., A comparative analysis of printed circuit drying methods for the reliability of assembly process, Microelectronics Reliability 129, 2022, pp.114478-1-8, http://dx.doi.org/10.1016/j.microrel.2022.114478